发明名称 Continuous plane of thin-film materials for a two-terminal cross-point memory
摘要 A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper.
申请公布号 US7888711(B2) 申请公布日期 2011.02.15
申请号 US20100803214 申请日期 2010.06.21
申请人 UNITY SEMICONDUCTOR CORPORATION 发明人 CHEUNG ROBIN;RINERSON DARRELL;OH TRAVIS BYONGHYOP;BORNSTEIN JONATHAN;HANSEN DAVID
分类号 H01L29/66 主分类号 H01L29/66
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