| 摘要 |
The invention relates to an image generation device ( 1 ), particularly a 3D camera. The inventive image generation device ( 1 ) is designed in order to obtain small dimensions and to take thermal considerations into account. The camera ( 1 ) has at least one, in particular, rigid first printed board ( 10 ) for highly complex semiconductors such as a microcontroller ( 11 ), memory ( 12 ), etc. with at least one optical image recording sensor ( 50 ), and has a second printed board ( 20 ) for all other components such as, in particular, large capacitors, transistors, resistors, coils ( 21 ) or plugs ( 22 ), etc. The first ( 10 ) and second ( 20 ) printed boards are mounted on, preferably glued to, a metallic base plate ( 40 ). The inventive image generation device ( 1 ) advantageously comprises, at least in the area of its optics modules ( 50, 51, 52, 53 ), a minimum overall height thus making it particularly well-suited for use as a built-in component serving as an occupant recognition unit in the roofliner, as a lane-change assistant in the exterior rearview mirror or for similar applications or installation locations in a motor vehicle even in locations where extreme installation conditions exist and prior art camera systems fail. |
