| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which acts as a dicing tape in a dicing process and also acts as an adhesive sheet having excellent connection reliability in a process for connecting a semiconductor element to a support member, to provide a semiconductor device using the adhesive sheet, and to provide a method for producing the same. SOLUTION: This adhesive sheet comprises at least an adhesive layer comprising (A) an epoxy resin, an epoxy resin curing agent and (B) a polymer component containing a functional monomer and having a weight-average mol. wt. of≥100,000, a tackifier layer containing a radiation-polymerizable compound, and a substrate layer, wherein an adhesive strength on the interface between the adhesive layer and the tackifier layer before the irradiation of radiations is≥200 mN/cm and the tack strength of the adhesive layer by 5.1 mmϕprobe measurement at 25°C in an uncured or semi-cured state is≥0.5 N. The semiconductor device using the adhesive sheet. And the method for producing the same. COPYRIGHT: (C)2004,JPO&NCIPI |
