| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve various problems caused by heat generation of a semiconductor package by effectively dissipating heat generated from the semiconductor package, in a wiring board with a semiconductor package incorporated therein that is formed by embedding a semiconductor package in an insulation member. <P>SOLUTION: The wiring board with a semiconductor package incorporated therein is structured such that, for a semiconductor package embedded in at least one of a plurality of insulation members, each of which is held among a plurality of wiring patterns, a principal surface located on a non-connection surface side of a semiconductor chip constituting the semiconductor package is connected to one of the plurality of wiring patterns by a thermally-conductive film or paste, and at least portions the plurality of wiring patterns, and at least a portion of the plurality of wiring patterns and the semiconductor chip are electrically connected with one another through a plurality of interlayer connection bodies. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
