发明名称 COPPER ALLOY MATERIAL AND METHOD FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper alloy material having excellent blanking workability while maintaining its strength and electrical conductivity required for electronic parts such as a terminal for a connector, in a Cu-Co-Si based copper alloy. <P>SOLUTION: The copper alloy material includes, by mass, 0.5 to 2.5% Co, and includes 0.1 to 1% Si, and in which the ratio of the Co to Si, i.e., Co/Si lies in the range of 2.5 to 4.5, and further includes at least one of additional element selected from the group composed of Cr, Fe, Ni, Al, Nb, Ti, V and Zr by 0.01 to 0.2%, and the balance Cu with inevitable impurities. The copper alloy material includes a compound having a diameter of 0.05 to 5μm and a density of 10<SP>3</SP>to 10<SP>5</SP>pieces/mm<SP>2</SP>and composed of at least one of element selected from the group composed of the above additional elements and Co, and Si. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011046970(A) 申请公布日期 2011.03.10
申请号 JP20090182794 申请日期 2009.08.05
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MATSUO RYOSUKE;EGUCHI TATSUHIKO;MIHARA KUNITERU;SATO KOJI
分类号 C22C9/06;C22C9/00;C22C9/02;C22C9/04;C22C9/10;C22F1/00;C22F1/08;H01B1/02;H01B13/00;H01R13/03;H01R43/16 主分类号 C22C9/06
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