| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit structure that improves the peel-off resistance of a stack die in die cutting, and a forming method for such an integrated circuit structure. <P>SOLUTION: The integrated circuit structure comprises a first die 10 including a TSV (Through Silicon Via), a second die 20 that is bonded on the first die 10 with the first die 10 having a surface facing the second die 20, and a molding compound 24 material a part of which is located on the first die 10 and the second die 20. The molding compound 24 comes in contact with the surface of the second die 20. Further, the molding compound 24 extends downward from the surface of the second die 20. <P>COPYRIGHT: (C)2011,JPO&INPIT |
