发明名称 |
PIEZOELECTRIC VIBRATING DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibrating device that raises productivity. <P>SOLUTION: A method for manufacturing a piezoelectric vibrating device includes the steps of: preparing a piezoelectric wafer on which a plurality of piezoelectric frames are formed (S112); preparing a lid wafer on which a plurality of lids are formed (S102), each sized substantially similarly to the frames; preparing a base wafer on which a plurality of bases are formed (S122), each base having through-holes passing from one side to the other side; forming a first bonding film along the frames on both surfaces of the piezoelectric wafer (S104); forming a second bonding film to meet the first bonding film on one surface of the lid wafer (S114); forming a third bonding film so as to meet the first bonding film on one surface of the base wafer (S124); disposing a bonding material between the first bonding film and the second bonding film and between the first bonding film and the third bonding film (S152); and bonding the piezoelectric wafer, the lid wafer and the base wafer (S154). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2011087275(A) |
申请公布日期 |
2011.04.28 |
申请号 |
JP20100069443 |
申请日期 |
2010.03.25 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
KAWAHARA HIROSHI;ICHIKAWA RYOICHI |
分类号 |
H03H3/02;H01L23/02;H01L23/04;H01L23/10;H03H9/02 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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