| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To precisely obtain a predetermined semiconductor element from a semiconductor substrate. <P>SOLUTION: A protective coating, such as a protective tape for protecting a semiconductor substrate, is provided on a first principal plane side of the semiconductor substrate where a plurality of semiconductor elements are formed (steps S2, S3). The semiconductor substrate is irradiated with laser beam through the protective coating to form a mark on at least one of the plurality of semiconductor elements formed on the semiconductor substrate (step S4). On the basis of the position of the chip where the mark is formed, the predetermined semiconductor element is obtained from the semiconductor substrate. The predetermined semiconductor element is, for example, a conforming semiconductor element. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
