| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide methods for manufacturing piezoelectric vibrating devices that is able to improve the productivity. <P>SOLUTION: A piezoelectric vibrating device manufacturing method includes the steps of preparing a base wafer (S122, S124), having a first bonding film having a plurality of bases, each for placing a piezoelectric vibrating piece thereon and being formed around the bases and a first recess (66) formed at a position in contact with the first bonding film; preparing a lid wafer, having a second bonding film having a plurality of lids covering the piezoelectric vibrating piece and formed around the lids and a second recess (67), formed at a position in contact with the second bonding film (S102, S104); placing a bonding material (75) in the first recess (66) or the second recess (67); and bonding together the base wafer and the lid wafer, by temporarily melting the bonding material to have it flow along the first bonding film and thereafter, the second bonding film and solidifying the bonding material (S152). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
