发明名称 |
METHOD FOR PRODUCING COMPRESSION MOLDING OF RESIN COMPOSITION INCLUDING HIGHLY CHARGED INORGANIC FILLER |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a compression molding having high thermal conductivity due to a highly charged inorganic filler. SOLUTION: The method for producing the resin molding (d) includes a process of carrying out compression molding of a resin composition (c) containing at least a resin (a) and the inorganic filler (b). A volume filling factor (A) of the inorganic filler (b) in the resin composition (c) and a volume filling factor (B) of the inorganic filler (b) in the compression molding (d) satisfy a relation: B/A≥1.05. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011088383(A) |
申请公布日期 |
2011.05.06 |
申请号 |
JP20090244556 |
申请日期 |
2009.10.23 |
申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
IWAKURA HIROKO;SATO MINORU;OTAKE TOSHIYUKI |
分类号 |
B29C43/02;B29K63/00;B29K105/22 |
主分类号 |
B29C43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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