发明名称 METHOD FOR PRODUCING COMPRESSION MOLDING OF RESIN COMPOSITION INCLUDING HIGHLY CHARGED INORGANIC FILLER
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a compression molding having high thermal conductivity due to a highly charged inorganic filler. SOLUTION: The method for producing the resin molding (d) includes a process of carrying out compression molding of a resin composition (c) containing at least a resin (a) and the inorganic filler (b). A volume filling factor (A) of the inorganic filler (b) in the resin composition (c) and a volume filling factor (B) of the inorganic filler (b) in the compression molding (d) satisfy a relation: B/A≥1.05. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011088383(A) 申请公布日期 2011.05.06
申请号 JP20090244556 申请日期 2009.10.23
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 IWAKURA HIROKO;SATO MINORU;OTAKE TOSHIYUKI
分类号 B29C43/02;B29K63/00;B29K105/22 主分类号 B29C43/02
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