| 摘要 |
PROBLEM TO BE SOLVED: To solve the difficulty of high density mounting of a circuit board and breakdown of electronic components due to impact. SOLUTION: A circuit board includes a substrate, and an electronic component mounted on one surface and the other surface of the substrate, and a magnetic shield which covers the periphery of the electronic component mounted on the other surface of the substrate. The magnetic shield includes a sidewall portion which is fixed onto the substrate and erected and which covers the side portion of the electronic component and a top board portion which is supported by the side wall portion, positioned in such a manner that it is separated from the surface of the substrate, and which covers the upper portion of the electronic component. A portion of the sidewall portion located on a portion on which the electronic component is arranged on one surface side of the substrate of the sidewall portion of the magnetic shield is cut. COPYRIGHT: (C)2011,JPO&INPIT
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