发明名称 CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conducting film used for connection, such that an electronic component including a connection terminal with a narrow pitch is mounted on a wiring board. SOLUTION: An organic insulating layer 5 is provided with a plurality of linear conductors 3, extending in the thickness direction, and the plurality of linear conductors 3 are exposed from the surface of the organic insulating layer 5 through the organic insulating layer 5. The organic insulating layer 5 is a thermosetting resin layer in an un-cured condition. Here, the diameter of the linear conductor 3 is in the range of 30-1,000 nm, and the pitch of the linear conductor 3 is in the range of 40-1,200 nm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091185(A) 申请公布日期 2011.05.06
申请号 JP20090243030 申请日期 2009.10.22
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HORIUCHI MICHIO;TOKUTAKE YASUE;MATSUDA YUICHI;KOBAYASHI TAKESHI;DENDA TATSUAKI
分类号 H01L23/32;H01B5/16;H01B13/00;H01R11/01 主分类号 H01L23/32
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