| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate waste of a semiconductor device and to improve the yield when manufacturing a wiring board having the semiconductor device buried and mounted. <P>SOLUTION: While a semiconductor device sealing board 20A having the semiconductor device 21 coated with an insulating layer 23 is fabricated, a rewiring board 30A having a rewiring layer laminated is fabricated in a process different therefrom. Then the semiconductor device sealing board 20A and rewiring board 30A are aligned and stacked such that an electrode terminal 22 of the semiconductor device 21 and a corresponding conductive bump 35 on the rewiring layer as an outermost layer are opposed to each other, and the electrode terminal 22 and conductive bump 35 are connected to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
