PRINTED CIRCUIT BOARD CONTAINING VIA PAD WITH IRREGULAR PATTERN AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board containing a via pad with an irregular pattern, and to provide a method of manufacturing the same. SOLUTION: The printed circuit board includes: a circuit pattern 12 formed on a first insulating layer 11; the via pad 13 with irregular patterns 13a and 13b disposed away from the circuit pattern 12 on the first insulating layer 11 and formed with a larger cross-section area than a via hole A in the lower surface where the via hole A is formed; a second insulating body 14 formed on the via pad 13, in which the via hole A is not formed, and the circuit pattern 12; and a copper film layer 15 formed on the second insulating body 14 and the via hole A. COPYRIGHT: (C)2011,JPO&INPIT