| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection reliability between an electrode and a solder bump in a semiconductor device and a method of manufacturing the same. SOLUTION: The semiconductor device includes a circuit board 1 on which a first electrode 4 containing copper is formed, a barrier metal layer 10 formed on a surface of the first electrode 4 and suppressing reaction of the copper and tin, a tin layer 12 formed on the barrier metal layer 10, the lead-free solder bump 18 bonded to the first electrode 4 through the tin layer 12, and a semiconductor package 20 having a second electrode 22 bonded to the lead-free solder bump 18. COPYRIGHT: (C)2011,JPO&INPIT
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