发明名称 RADIAL LEAD ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a radial lead electronic component which is superior in vibration resistance and is able to readily dissipate the heat of an element body. SOLUTION: The radial lead electronic component has a planar substrate 4 forming the element body of an electronic component 2; electrode films 6, formed on front and rear surfaces of the substrate 4, respectively; two lead wires 8, each having connecting portions 8a which are electrically connected to the electrode films 6 and crossing at a predetermined crossing angle ofθ, which is smaller than 180°, when viewed from the surface of the substrate 4, and lead leg portions 8f extending outward from the connecting portions 8a; and an external sheath resin 12 for covering the surrounding of the substrate 4, connected to the connecting portions 8a of the lead wires 8. When the surface of the external sheath resin 12, covering a lead crossing region 22 on the surface of the substrate 4 to which the connecting portions 8a cross at the crossing angleθ, is set as a reference plane 16, a convex portion 15 protruding at a predetermined height T2 from the reference plane 16 is formed on the outer surface of the external sheath resin 12 in the outside of the lead crossing region 22; and the convex portion 15 has a surface area of 1/2 or below of the surface area of the substrate 4, when viewed from the surface of the substrate 4. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011096898(A) 申请公布日期 2011.05.12
申请号 JP20090250490 申请日期 2009.10.30
申请人 TDK CORP 发明人 ANPO MIYUKI;TSUTSUMI TOMOHISA
分类号 H01G2/04;H01C1/02;H01C7/10;H01F27/29;H01G2/08;H01G2/24;H01G4/12;H01G4/224;H01G4/228 主分类号 H01G2/04
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