| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the dust, which is deposited on a laser beam machining apparatus, from rising and adhering to a to-be-machined substrate. <P>SOLUTION: The laser beam machining apparatus is used to perform laser beam machining of a to-be-machined substrate 60 having a substrate and a thin film, which is arranged on the substrate. The laser beam machining apparatus includes: a holding part 10 for holding the to-be-machined substrate 60; a laser beam oscillator 20 for applying a laser beam L to the thin film; and a dust recovering member 15, which is provided in the thin film side of the to-be-machined substrate 60 held by the holding part 10 and recovers the dust generated from the thin film. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
