| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip with a thin adhesive layer, which enables miniaturization of a semiconductor device. SOLUTION: The manufacturing method for the semiconductor chip with the adhesive layer includes an applying process of applying an adhesive composition 40 containing a solvent to another surface of a semiconductor wafer 10 having a circuit on its one surface, an adhesive layer forming process of eliminating the solvent on the semiconductor wafer 10 to form the adhesive layer, and a cutting process of cutting the semiconductor wafer 10 having the adhesive layer 40 formed thereon to obtain semiconductor chips with the adhesive layers. COPYRIGHT: (C)2011,JPO&INPIT |
