| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease man-hours for assembly, to improve assembly accuracy, and to eliminate the need of optical adjustment by forming a simple structure by decreasing the number of components. <P>SOLUTION: Partial parts (height direction positioning sections 1b) of a holder member are directly mounted on an upper surface of a sensor chip 5 from a structure where the holder member 1 is positioned with respect to a substrate 4, thereby a simple structure is provided by greatly reducing the number of components of this imaging module 10 compared to a conventional art, and the distance between condenser lenses 2a, 2b fixed on the holder member 1 and the upper surface of the sensor chip 5 can be accurately positioned in the vertical direction (Z-direction). <P>COPYRIGHT: (C)2011,JPO&INPIT |
