发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENTS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic components that strengthens the junction of an external electrode and an element body surface. <P>SOLUTION: A glass coating layer 81 is formed on the whole surface of an element body 71 of a lamination layer chip varistor. Both ends of the element body 71 are coated by a glass-containing electrode paste with silver as the main component of a conductive material. Baking is carried out to form external electrodes 75 and 77 at a temperature higher than a crystallization temperature of glass, concretely at a temperature equal to or more than the crystallization temperature of glass and equal to or less than 800°C. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011124403(A) 申请公布日期 2011.06.23
申请号 JP20090281215 申请日期 2009.12.11
申请人 KOA CORP 发明人 GOMI YOJI;KANZAKI TATSUYA
分类号 H01C7/10 主分类号 H01C7/10
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