METHOD FOR CUTTING JOINED GLASS, METHOD FOR MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED CLOCK

摘要

PROBLEM TO BE SOLVED: To provide a method for cutting joined glass which suppresses the generation of crushes and chippings upon cutting of the joined glass, and can cut the joined glass per prescribed size, a method for manufacturing a package, a package, a piezoelectric vibrator, an oscillator, electronic equipment and a radio-controlled clock.

SOLUTION: The method includes: a scribing step of emitting a laser beam of an absorption wavelength in a wafer joined body 60 along a contour to form a scribe line M' on a wafer 50 for a lid substrate; and a breaking step of cutting the wafer joined boy 60 by applying fracture stress along the scribe line M' to divide the wafer joined body 60 into a plurality of piezoelectric vibrators. The cutting step is performed in such a manner that the wafer joined body 60 is placed on a silicone rubber 71, and the outside edge face 50b in the wafer 50 for a lid substrate is turned toward the silicone rubber 71.

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