| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic part disposing lead terminals on the side face of an insulating base body with a high density while firmly joining a connecting pad on the insulating base body and electronic equipment. <P>SOLUTION: The package for housing the electronic part is composed of a plurality of insulating layers. The package for housing the electronic part has the insulating base body 1 with a loading section 1a for the electronic part 5, and a wiring conductor 2 formed among a plurality of the insulating layers and electrically connected to an electrode for the electronic part 5. The package further has a conductor 3 penetrated to at least one layer of a plurality of the insulating layers and electrically connected to the wiring conductor 2 while a part of its surface is exposed to the side face of the insulating base body 1, and the lead terminal 4 joined at a site exposed to the side face of the insulating base body 1 for the conductor 3. In the conductor 3, the width W2 of the site buried into the insulating base body is made wider than that W1 of the site exposed to the side face of the insulating base body 1. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
