| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device that permits manufacture through a simplified process. <P>SOLUTION: The light emitting device includes: a package body having first and second major surfaces and a plurality of side surfaces formed between the major surfaces, the package body having first and second level regions defined to include the first and the second major surface, respectively, and formed of curing resin; a first and a second block for external terminal disposed on both ends of the package body, respectively, each having a first and a second surface, and side surfaces between the first and the second surface with the first surface being exposed to the first major surface of the package body, the first and the second block for external terminal each having a connection connected to the other surface which is externally exposed in a portion located internally of the package body; a light emitting diode chip positioned in the first level region between the first and the second block for external terminal and having an electrode-forming surface on which a first and a second electrode are formed; and wires adapted to electrically connect the first and the second electrode of the light emitting diode chip to the connections of the first and the second block for external terminal, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT |
