| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for molding carrier tape, whereby a positional relation between a minute-component accommodating pocket and an engagement portion for tape feed is strictly regulated, and trouble such as falling of component is greatly suppressed even when an extremely minute electronic component is accommodated or taken out. <P>SOLUTION: The method for molding carrier tape includes: molding strip tape made of resin, such that component accommodating pockets 2 and positioning posts 5 are formed; conveying the stripe tape positioned by the positioning posts; and subsequently piercing sprocket holes 3 in the positions of the positioning posts. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
