| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device efficiently extracting light emitted from an LED chip while improving heat dissipation characteristics, and a method for manufacturing the light emitting device. <P>SOLUTION: A base substrate 10 is, for example, a glass epoxy substrate such as FR-4, laminated with a glass cloth base material 1, an insulating layer 2 and a copper foil 3. A circular fitting hole 31 is formed at a predetermined position of the base substrate 10. A disc-like aluminum chip 4 is fitted in the fitting hole 31. An LED chip 20 is directly mounted on a surface of the aluminum chip 4. Wire bonding using gold wire 21 is performed between an electrode of the LED chip 20 and the copper foil 3 subjected to gold plating 5. <P>COPYRIGHT: (C)2011,JPO&INPIT |
