| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin, lightweight, high performance, and low in cost semiconductor device by reducing a ground area required for a power supply wiring and a ground wiring of a functional circuit and simultaneously suppressing a drop in power supply voltage and a rise in ground voltage due to current consumption. SOLUTION: The semiconductor device has a power supply wiring 1009 for applying a power supply voltage and a ground wiring 1010 for applying the ground voltage formed in a grid-like arrangement in the functional circuit. The drop in power supply voltage and the rise in ground potential are greatly decreased through the grid-like arrangement. Even when a wiring width is made narrow, the drop in power supply voltage and the rise in ground potential are suppressed to the same extent with a non-grid-like arrangement, so the installation area of the power supply wiring and ground wiring is greatly reduced. COPYRIGHT: (C)2011,JPO&INPIT |
