PHOTOSENSITIVE RESIN COMPOSITION AND SUBSTRATE FOR CIRCUIT FORMATION USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a pattern having a low hygroscopic expansion coefficient and good solubility in a developer, and to provide a pattern forming method and a substrate for circuit formation using the photosensitive resin composition.

SOLUTION: The photosensitive resin composition includes (a) a polymer having a structural unit represented by formula (A), (b) a compound which generates a radical upon irradiation with actinic rays, and having a structure represented by formula (B), and (c) an arylsulfonamide derivative.

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