| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce dissipation of heat of a circuit component and a pressure difference between the inside and outside of a housing chamber. <P>SOLUTION: An inverter apparatus 1 includes a control unit 1b, a power unit 1c, and a capacitor unit 1d. The power unit 1c includes six semiconductor devices 27. The respective semiconductor devices 27 include a semiconductor module 22, and a pair of heat sinks 24 attached onto both the surfaces. A plurality of heat sinks 24 are disposed in an air path for cooling air. The housing chamber of the control unit 1b communicates with the air path for cooling air. Thus, the cooling air partially flows inside the housing chamber of the control unit 1b. Also, the cooling air partially flows inside the housing chamber of the capacitor unit 1d. <P>COPYRIGHT: (C)2011,JPO&INPIT |
