| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor that prevents the generation of cracks in a joint between a chip resistor and solder even if energization is repeatedly executed in a state that the chip resistor is mounted to a printed circuit board via a solder fillet. <P>SOLUTION: The chip resistor P1 has a side electrode 50 formed of resin-based conductive paste (for example, resin silver paste), and plating 60 formed on the side electrode. The plating 60 has copper plating 62 whose thickness is 10-30μm as an inner layer. The copper plating 62 is laminated on the surface of the side electrode 50. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
