RESIST APPLICATION DEVICE AND RESIST APPLICATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a resist application device which provides a resist film significantly small in defect occurrence frequency, and to provide a resist application method. SOLUTION: The resist application device includes: a resist nozzle for ejecting a resist liquid for applying a resist film to at least a substrate; a resist tank for storing the resist liquid therein; a resist liquid feed line between a suck back valve arranged in the resist liquid feed line and the resist nozzle out of a resist liquid feed line connecting the resist tank to the resist nozzle; and at least a temperature control medium line and a temperature controller as a temperature control mechanism for controlling the temperature of the resist liquid in the respective regions of the resist liquid feed line between the resist tank and the suck back valve out of the resist liquid feed line connecting the resist tank to the resist nozzle; wherein the temperature control medium line feeds the temperature control medium from the temperature controller to the respective regions independently of one another. COPYRIGHT: (C)2011,JPO&INPIT