METHOD FOR MANUFACTURING EXTRA-THIN WIRE OF COMPOUND SEMICONDUCTOR, AND ASSEMBLY OF EXTRA-THIN WIRE OF COMPOUND SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an extra-thin wire of a compound semiconductor with high precision, which is suitable for mass production, and to provide an assembly of the extra-thin wire of the compound semiconductor. SOLUTION: The manufacturing method includes: filling a fine through-hole of a template having a plurality of fine through-holes with a nanosize with the compound semiconductor by using an electrodeposition method; or filling the fine through-hole alternately with a first element and a second element which are constituent elements of the compound semiconductor into a layer state, and then diffusion-heat-treating the first element and the second element. COPYRIGHT: (C)2011,JPO&INPIT