发明名称 LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
摘要 A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
申请公布号 US2011204125(A1) 申请公布日期 2011.08.25
申请号 US201113099394 申请日期 2011.05.03
申请人 YASUDA YUSUKE;MORITA TOSHIAKI;IDE EIICHI;HOZOJI HIROSHI;ISHII TOSHIAKI 发明人 YASUDA YUSUKE;MORITA TOSHIAKI;IDE EIICHI;HOZOJI HIROSHI;ISHII TOSHIAKI
分类号 B23K1/20 主分类号 B23K1/20
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