发明名称 Plating parts of mouldings - in transparent polystyrene
摘要 <p>Articles from transparent resins of the polystyrene series are made by enveloping desired portions of the surface of the moulded articles by a point consisting principally of cpds. of high m.w. contg. Cl or F, dispersing, as emulsifier, a solvent having a solubility perameter of 7.0-11.0, chosen from aromatic, chlorinated aromatic or alicyclic hydrocarbons, ketones and esters in water using a surfactant; putting the moulded articles in the emulsion contg. 2-30% solvent, then in hot water and in an active sol., submitting the moulded panel first to a non-electrolytic and then an electrolytic plating, to deposit a single metallic film on the surface of the panel except where coated by the paint.</p>
申请公布号 FR2132355(A1) 申请公布日期 1972.11.17
申请号 FR19720011564 申请日期 1972.03.31
申请人 SHOWA DENKO KK;TOYO KAKO CO LTD 发明人
分类号 B44F1/06;C23C18/16;C23C18/26;(IPC1-7):23B5/00;44C3/00;29C27/00 主分类号 B44F1/06
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