| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique enabling arrangement of a shading part which efficiently suppresses ghost by avoiding contact between a shading member and a bonding wire. <P>SOLUTION: The exposure head includes a substrate equipped with a wiring layer, a first light-emitting chip placed on the substrate having first light-emitting elements electrically connected with the wiring layer via the bonding wire, the shading part having a first hole through which the light emitted from the first light-emitting element passes, and a first imaging optical system which images the light emitted from the first light-emitting element and passed through the first hole. The exposure head is formed to have the expression of relation: x1<Dap/2 and L1>L2 (wherein x1 is a distance from an optical axis of the first imaging optical system to the first light-emitting element, Dap is a size of the first hole, L1: a distance from the substrate of the bonding wire at the most separated position from the substrate, and L2: a distance between the shading part and the substrate). <P>COPYRIGHT: (C)2011,JPO&INPIT |
