摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor power module that reduces loss. <P>SOLUTION: The semiconductor power module 110 comprises DC terminals 111a, 111b to be connected to a capacitor module 200. The semiconductor power module 110 is used in combination with a waterway body 101 for cooling. The DC terminals 111a, 111b protrude toward the capacitor module 200 beyond the waterway body 101. <P>COPYRIGHT: (C)2011,JPO&INPIT |