发明名称 SEMICONDUCTOR POWER MODULE, POWER CONVERSION DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING WATERWAY BODY FOR SEMICONDUCTOR POWER MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor power module that reduces loss. <P>SOLUTION: The semiconductor power module 110 comprises DC terminals 111a, 111b to be connected to a capacitor module 200. The semiconductor power module 110 is used in combination with a waterway body 101 for cooling. The DC terminals 111a, 111b protrude toward the capacitor module 200 beyond the waterway body 101. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011177004(A) 申请公布日期 2011.09.08
申请号 JP20100253373 申请日期 2010.11.12
申请人 HITACHI LTD 发明人 HORIUCHI KEISUKE;HIYOSHI MICHIAKI;SASAKI KOJI
分类号 H02M7/48 主分类号 H02M7/48
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