| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductor sealing giving a cured material imparted with excellent luminance stability while keeping high heat-resistance and transparency, its cured material, and an optical semiconductor device produced by sealing an optical semiconductor element with the composition. <P>SOLUTION: The resin composition for optical semiconductor sealing contains an epoxy resin, a curing agent and a cure accelerator, wherein the epoxy resin contains 55-100 wt.%, based on total epoxy resin, of an alicyclic epoxy resin (A) comprising at least one kind of compound selected from the group consisting of a compound expressed by formula (I), a compound having an epoxy group bonded to an alicyclic group directly through a single bond, and a compound having≥3 epoxy groups comprising two adjacent carbon atoms and an oxygen atom constituting the alicyclic group, the curing agent is an acid anhydride curing agent, and the cure accelerator contains an ionically bonded material of a phosphonium ion and a halogen anion capable of forming an ionic pair with the phosphonium ion. In formula (I), X is a linking group comprising a single bond, a bivalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group obtained by linking a plurality of the groups and bonds. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
