DEVICE AND METHOD FOR SUBSTRATE PROCESSING

摘要

The present invention relates to a device for processing substrates in a processing system having at least one process tool disposed in at least one process area, said tool comprising two substrate levels disposed opposite each other and aligned at least approximately perpendicular, wherein the device is adapted for processing at least two substrates at the same time in the process area by means of the process tool, wherein the substrates can be disposed in the substrate levels so that coatings of the substrates face each other and a quasi-closed process space is formed between the substrates at least during processing. The invention further relates to a method for processing coated substrates in a processing system, wherein the substrates comprise coatings and the substrates are each disposed opposite each other, such that the coatings of the substrates face each other and a quasi-closed process space is formed between the substrates at least during processing.