| 摘要 |
PROBLEM TO BE SOLVED: To provide an air conditioning device keeping an indoor unit compact as a semiconductor element can be cooled without mounting a heat sink and an air-cooling fan for cooling the semiconductor element inside of the indoor unit.SOLUTION: This air conditioning device includes a heat exchanger 3b, a conductive heated body 2 for distributing the air passing through the heat exchanger 3b, a coil 5 for inductively heating the heated body 2, and a driving circuit 12 having the semiconductor element 9 for switching, and supplying high-frequency current to the coil 5, and heat generated by the semiconductor element 9 for switching is radiated through the heat exchanger 3b. |
