| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of cutting failure of a substrate in a method for manufacturing a semiconductor device.SOLUTION: A wiring board 20 including a semiconductor chip mounted in each of a plurality of device regions 20a is divided using a dicing blade (rotary blade) 40. In the dicing process, the wiring board 20 is divided along each dicing region 20c using the dicing blade 40 while a part of each surface 10a in each of the device regions 20a is supported by a top face 41e of a fixture 41 and a surface in the dicing region 20c is not supported, wherein a side face 40b and a tapered face (inclined face) 40a forming an angle of more than 90° are formed at a tip of the dicing blade 40. |
