| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device package frame that improves reliability of operation of a light emitting device by improving coupling capability of a frame body.SOLUTION: The package frame for the light emitting device has the frame body 10 and a cup 20. The frame body 10 includes a base 12 and a plurality of connection legs 14, and also has a front side face, a rear side face, and a grooved segment 16 formed on the rear side face. The grooved segment 16 exhibits capillarity to allow molten solder to quickly flow and spread in the groove 162, thereby controlling a spread of the solder on the frame body 10. |
