PLATING EQUIPMENT, PLATING METHOD AND METHOD FOR MANUFACTURING CHIP TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide plating equipment and a plating method which provide a plating film with high-quality and uniform film thickness, have improved plating efficiency, and achieve energy saving, and to provide a method for manufacturing a chip type electronic component.SOLUTION: The plating equipment has: a carrier plate 22 having a storage section 24 to store an element body 10; a conveyor belt 30 which moves together with the carrier plate 22; a plating solution impregnating roller 40 which supplies a plating solution to the storage section 24 during movement of the carrier plate 22; and an anode electrode and a cathode electrode indirectly or directly connected with portions planned to be plated of the element body 10 in a state in which the plating solution is supplied to the storage section 24.