| 摘要 |
PROBLEM TO BE SOLVED: To eliminate residual metal burrs on the cutting plane of a lead frame while preventing an adverse effect on a sealing resin and the lead frame caused by etching.SOLUTION: A plurality of electronic components (such as a semiconductor chip 10) are mounted on a lead frame 5, and the lead frame 5 including the electronic components is collectively enclosed by sealing resin 6, thereby forming a batch enclosure block 1. Then, a first cutting of the batch enclosure block 1 is performed from one surface side 1a with the depth of cut up to the cutting-off position of the lead frame 5 using a dicing blade (such as a first dicing blade). After that, metal burrs 3 produced in the cutting plane of the lead frame 5 resulting from the first cutting are removed by etching. Finally, the batch enclosure block 1 is diced into pieces for electronic devices (such as a semiconductor package) that use the electronic components by performing a second cutting as a follow-on to the first cutting using a dicing blade (such as a second dicing blade). |
