发明名称 LAMINATION TYPE CHIP CAPACITOR AND CIRCUIT BOARD APPARATUS HAVING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a lamination type chip capacitor which satisfies all low ESL and high ESR properties without changing materials, and keeps constant an impedance of an electric power distribution network in a wide frequency range.SOLUTION: A lamination type chip capacitor has a lamination structure in which a plurality of dielectric layers are laminated. The lamination type chip capacitor has a laminate structure in which a plurality of dielectric layers are laminated, and includes: a capacitor body including a first capacitor part and a second capacitor part which are arranged along a lamination direction; at least one of first to fourth external electrodes formed on a side surface of the capacitor body, the first and the third external electrodes having the same polarization, and the second and the fourth external electrodes having the same polarization different from that of the first external electrode; and at least one coupling conductor line formed on an outer surface of the capacitor body and which interconnects the first external electrode and the third external electrode or interconnects the second external electrode and the fourth external electrode.
申请公布号 JP2011216898(A) 申请公布日期 2011.10.27
申请号 JP20110135671 申请日期 2011.06.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/30;H01G2/06;H01G4/12;H01G4/38;H01G4/40;H05K3/46 主分类号 H01G4/30
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