| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems, wherein miniaturization of supporting leg wiring is determined by the accuracy of mask for miniaturization of supporting leg wiring, with respect to the miniaturization of supporting leg wiring, and stable miniaturization with a size of precision which is lower for a mask has been difficult, when reducing the thermal conductance of a supporting leg in prior art.SOLUTION: In miniaturization of the supporting leg wiring, the supporting leg 3 can be reduced in height, by etching only a region equivalent to the supporting leg 3 to a BPSG 10 and a TEOS 11, namely, surrounding interlayer insulation films, and thereby reducing the sectional area of the supporting leg 3, thus providing an infrared image pickup device that has miniaturized supporting leg structure, independently of the size rule determined by a mask. |
