| 摘要 |
Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A) , a curing agent (B) ,and an inorganic filler (C) , wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not lessthan 40% in terms of area percentage and the content of a C[err]4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin compositionfor encapsulating a semiconductor.No Suitable Figure |
