| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact, lightweight and highly versatile power conversion device. <P>SOLUTION: The power conversion device comprises a plurality of semiconductor elements 1200a, 1200b forming power conversion circuits and a cooling device. The cooling device is structured so that a plurality of cooling modules 100a, 100b, each having a mounting surface for the semiconductor elements, are combined in series or in parallel to a flow direction of cooling air 1301, making at least one of the structures of the cooling modules 100a, 100b different, thereby attaining size and weight reductions in the cooling device, satisfying upper permissible temperature limits of the elements according to calorific values or calorific densities of the semiconductor elements 1200a, 1200b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
