| 摘要 |
<p>A method of fabricating a semiconductor device according to an embodiment includes: forming a core material on a workpiece material; forming a cover film to cover the upper and side surfaces of the core material; after forming the cover film, removing the core material; after removing the core material, removing the cover film while leaving portions thereof located on the side surfaces of the core material, so as to form sidewall spacer masks; and etching the workpiece material by using the sidewall spacer masks as a mask.</p> |
