| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the distance on a flat plane between leads and a semiconductor element where plate-like internal leads are used for connection and also capable of suppressing variation in the joined positions of the internal leads through improved reliability of joints. <P>SOLUTION: A protruded part with a flat and circular top of a second lead is formed by a dowel-shaping process, thereby suppressing changes in the planar shape of the second lead. Further, the surface of the protruded part is covered with a solder to secure a solder thickness by an amount equal to the height of the protruded part, thereby improving the reliability of solder joints. The internal leads on a semiconductor element are corrected for irregular placement by a self-alignment effect of interposing molten solder, so that the joined positions of the internal leads are normalized. <P>COPYRIGHT: (C)2012,JPO&INPIT |
