| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder pellet reducing the occurence of voids by solving a problem that the heat radiation effect is reduced, and the bonding strength is reduced because a lot of voids occurs at the joint area when a conventional lead-free solder pellet is used in die bonding of a semiconductor device and a substrate of an electronic component to each other. <P>SOLUTION: The pellet, having a thickness between 0.05 and 1 mm, forms a colorless transparent protective film comprising Sn-30 to 50 at% O-5 to 15 at% P or Sn-10 to 30 at% In-40 to 60 at% O-5 to 15 at% P, on the surface of a lead-free solder alloy including Sn as a principal component when heated for soldering. <P>COPYRIGHT: (C)2012,JPO&INPIT |
