SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to secure a necessary interval between substrates by forming a cavity capable of avoiding the conflict of a semiconductor chip and a substrate. CONSTITUTION: A second substrate(200) which includes first substrate(100) and a core(210) is provided. The core comprises a metal core. The metal core is exposed by eliminating one side of the second substrate as a form corresponding to a semiconductor chip using a laser drill process. The metal core which is exposed is eliminated by etching. A cavity(215) corresponding to the semiconductor chip is formed. A solder bump is laminated on the first substrate. The second substrate is laminated on the first substrate in order to accept the semiconductor chip in the cavity. The semiconductor chip is mounted in the first substrate.